Silicon Wafer Bonding Technology for Vlsi and Mems Applications

by S.S. Iyer (Editor)

The bonding of silicon wafers with a silicon dioxide insulating layer between them (an SOI, or "silicon on insulator," technique) permits considerable improvements in the performance of microelectronic circuits produced by very large scale integration (VLSI) and is an enabling technology in the rapidly growing field of microelectromechanical systems (MEMS). The technique has now reached the stage where it is ready to be applied in practice. Engineers engaged in the development of volume production systems employing wafer bonding are in need of guidance from experts in the industry who have been pioneering the technique - the book is designed for this purpose. Applications in CMOS, photonics, optoelectronics and MEMS are discussed. It is liberally illustrated, fully indexed and in "easy-to-absorb" format.

200 pages, Hardcover

First published December 15, 2001